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| March 5, 2026 - Regular School Board Meeting | ||
| Title C16 - RFP to be Awarded | ||
| Description Award RFP as required per FS 287, DOE 6A-1.012 and School Board Policy a. Wireless Access Points RFP #25-MI-90: Purchase shall align with E-Rate Funding Year 2026, FCC Form 470 Application Number 260006014 26SBCC-470_C2. The RFP was established for the purchase of Meraki CW9164 Wi-Fi 6E (802.11ax) indoor Wireless Access Points (WAP or AP), and Meraki MR86 Wi-Fi 6 (802.11ax) outdoor Wireless Access Points (WAP or AP) or equivalent, and any necessary licenses, antennas, cables, mounting brackets, training to be used at various schools and facilities throughout Clay County. The vendor awarded was the highest-ranking firm by the RFP selection committee. | ||
| Gap Analysis The District requires contractors to provide services to ensure our ​​facilities and equipment are maintained and functional. The District requires vendors to provide products and/or services to ensure our students and staff receive the products and/or services to meet their needs. | ||
| Previous Outcomes The District has no prior Board approved Bids or RFPs for this type of service. | ||
| Expected Outcomes Upon approval by the Board, we expect the contractors and vendors to provide quality services and products at the terms and conditions listed in the RFP. | ||
| Strategic Plan Goal Goal 5; Strategy 5.4; Enhance fiscal practices that enable the district to maximize effectiveness and efficiency. | ||
| Recommendation Award RFP as follows: a. Wireless Access Points RFP #25-MI-90:
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| Contact Ms. Dawn Posey, Assistant Superintendent for Business Affairs, Phone: (904)336-6721, Email: dawn.posey@myoneclay.net | ||
| Financial Impact a. Wireless Access Points RFP #25-MI-90: Estimated Total $3,596,397.88 from E-Rate and General Funds. The District pays 20% estimated $719,249.58 via SPI invoicing for E-Rate. Cost for the hardware & the required licenses for 7 years. | ||
| Review Comments | ||
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Attachments 4 RFP 25-MI-90 Award _ FCC Form 470 260006014 26SBCC-470_C2.pdf |